This product blends cutting-edge technology with precision, offering an array of features that set it apart in the world of adhesives.
Key Features:
1. High Tg, Low CTE:
Elevate your projects with an adhesive that combines a high glass transition temperature (Tg) with low coefficient of thermal expansion (CTE). This dynamic duo ensures unparalleled stability and durability, making it the ideal choice for applications demanding thermal resilience.
2. Fast UV Cure:
Revolutionize your workflow with the speed of light – literally! Our UV-curable adhesive features an impressively fast cure time, allowing you to achieve rapid results without compromising on strength or reliability.
3. Excellent S.I.R Performance:
Trust in superior Surface Insulation Resistance (S.I.R) performance. Our adhesive guarantees optimal electrical properties, ensuring a reliable bond in electronic applications where insulation integrity is paramount.
4. Excellent Reliability Performance:
When it comes to reliability, our adhesive stands tall. Engineered to surpass industry standards, it ensures a bond that not only meets but exceeds expectations, providing durability and longevity in every application.
Specifications: